JPH0340944B2 - - Google Patents
Info
- Publication number
- JPH0340944B2 JPH0340944B2 JP59014870A JP1487084A JPH0340944B2 JP H0340944 B2 JPH0340944 B2 JP H0340944B2 JP 59014870 A JP59014870 A JP 59014870A JP 1487084 A JP1487084 A JP 1487084A JP H0340944 B2 JPH0340944 B2 JP H0340944B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- tip
- shoulder
- fiber sensor
- detected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1487084A JPS60160137A (ja) | 1984-01-30 | 1984-01-30 | リ−ド曲り検出方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1487084A JPS60160137A (ja) | 1984-01-30 | 1984-01-30 | リ−ド曲り検出方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60160137A JPS60160137A (ja) | 1985-08-21 |
JPH0340944B2 true JPH0340944B2 (en]) | 1991-06-20 |
Family
ID=11873050
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1487084A Granted JPS60160137A (ja) | 1984-01-30 | 1984-01-30 | リ−ド曲り検出方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60160137A (en]) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6214449A (ja) * | 1985-07-11 | 1987-01-23 | Nec Kyushu Ltd | 半導体素子のリ−ド曲り検出方法 |
JP6829946B2 (ja) * | 2016-04-28 | 2021-02-17 | 川崎重工業株式会社 | 部品検査装置および方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5663275A (en) * | 1979-10-30 | 1981-05-29 | Nec Kyushu Ltd | Lead testing device for semiconductor device |
-
1984
- 1984-01-30 JP JP1487084A patent/JPS60160137A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60160137A (ja) | 1985-08-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |